Flip-chip IC bump separation at intermetallic layerThe constantly evolving electronics industry presents materials problems that require specialized equipment and creative solutions. MEE has long been a leader in laboratory testing applying traditional and advanced analytical methods. MEE helps you address your product challenges efficiently and effectively.



Typical MEE Projects for Electronic Components

  • Evaluation of black pad failure on PC board
  • Evaluation of BGA die separation
  • Analysis of electrical failure due to tin whiskers
  • Cross section of wafer metallization
  • SEM evaluation of photoresist residue on IC
  • Failure analysis of solder connections on PC board
  • Composition analysis for electroless nickel plating
  • Analysis of wire bond failures
  • Determination of silver migration on packaged IC devices
Contact us today to learn more.