Electronics
The constantly evolving electronics industry presents materials problems that require specialized equipment and creative solutions. MEE has long been a leader in laboratory testing applying traditional and advanced analytical methods. MEE helps you address your product challenges efficiently and effectively.
Typical MEE Projects for Electronic Components
- Evaluation of PCB, IC, and pad contamination
- Competitive analysis/reverse engineering of circuit boards and assemblies
- Evaluation of BGA and flip-chip bump failures
- Precision cross sectioning of buried features
- Evaluation of flexible circuitry and layer stackups
- Analysis of electrical failures due to dendritic growth and tin whiskers
- Cross section and precision measurement of PCB layering and wafer metallization
- Failure analysis of wirebond defects and solder connections
- Composition analysis for platings including electroless nickel and ENIG
- Examination and decapsulation of packaged IC devices
Contact us today to learn more.
Featured Case Study
Cracking Capacitors
Several printed circuit board (PCBs), each with 5 multilayer ceramic capacitors (MLCCs), were evaluated to characterize the capacitors. Each PCB was about 1 in. by 1 in. square. Four of the MLCCs were parallel to one edge of the PCB, and one MLCC was oriented at 90° to the others….